SPI 2013: Paris, France

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IEEE Components, Packaging & Manufacturing Technology Society

Electromagnetic Compatibility Society


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Over the past sixteen years, this workshop has evolved into a forum of exchange on the latest research and developments on innovative schemes for signal and power integrity, and in the field of interconnect modeling, simulation and measurement at chip board and package levels. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation.

In view of last year's success, the Committee is looking forward to the 17th Edition which will convene at the Hyatt Regency Paris Etoile (formerly Hotel Concorde La Fayette) in Paris, France.

The symposium will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN and will appear in IEEE Xplore.